Labels Milestones
BackInductor, SMD, 5.7x5.0x4.7mm, https://search.murata.co.jp/Ceramy/image/img/P02/JELF243A-0045.pdf Neosid, Air-Coil, SML, 2turn, HAM0331A, Neosid Air-Coil SML 3turn HDM0331A Neosid, Air-Coil, SML, 1turn, HDM0131A, Neosid Air-Coil SML 6-10turn HDM0431A-HDM1031A Neosid, Air-Coil, SML, 2turn, HAM0331A, Neosid Air-Coil SML 2turn HAM0231A Neosid, Air-Coil, SML, 3turn, HDM0331A, Neosid Air-Coil SML 6turn HAM0631A Neosid, Micro Coil, Inductor, Ms36-L, SMD, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_SMNE150.pdf Neosid Inductor SM-NE127 Fixed inductor SMD magnetically shielded Neosid, Power Inductor, Ms50T, SMD, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_SMPIC0512H.pdf Neosid Inductor SMs95 Fixed inductor anti clockwise Neosid, Inductor, SMs42, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_SMPIC0612H.pdf Neosid Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint Coilcraft XAL60xx series, https://www.coilcraft.com/pdfs/xal60xx.pdf Coilcraft 0603USB Series Common Mode Line Filter, https://www.we-online.com/components/products/datasheet/744232090.pdf common mode choke WE-CNSW SMT Common Mode Line Filter API Delevan, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SS)-5.30 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline (SM) - 5.28 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 8 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_QFN_9x9_MR_C04-00149e.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm.
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