Labels Milestones
BackPackage TO-269AA (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge DFS, see.
- 2.7x2.6mm; for InvenSense motion sensors; keepout area marked.
- Spokes where ground planes connect to holes .
- HLE-133-02-xxx-DV-LC, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- SIP-3 Ammo Pack, 2.65mm.
- 14-pin zero insertion force socket, through-hole, row spacing.