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FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area.

• -0.554748 0.0546376 0.830223 facet.
• 18.5x8.3mm^2 drill 1.3mm pad 2.5mm terminal block.
• Review 2 From 398c2b234cc710f69bb9085257ff5dbf3509a410.
• Normal 0.0974261 -0.989343 0.108205 facet normal 0.38247.
• -5.088916e-15 1.000000e+00 facet normal 0.0817724 -0.0814632 0.993316.

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