Labels Milestones
BackZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row.
- TO-252 TO-263 TO-268, https://www.fischerelektronik.de/pim/upload/fischerData/cadpdf/base/fk_244_13_d_pak.pdf Heatsink, 35mm x 26mm.
- Updates from real TL0x4s Merge.