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, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py NXP LGA, 8 Pin (https://www.qorvo.com/products/d/da001879), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size 31.5x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00081.

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