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HLE-107-02-xx-DV-PE-LC, 7 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, DF3EA-09P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator connector wire 1.5sqmm double-strain-relief Soldered wire connection, for 6 times 0.5 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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