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MC_1,5/10-GF-5.08; number of pins: 10; pin pitch: 5.08mm; Vertical || order number: 1924347 16A (HC Generic Phoenix Contact connector footprint for: GMSTB_2,5/4-GF-7,62; number of pins: 14; pin pitch: 5.08mm; Angled; threaded flange || order number: 1924486 16A (HC Generic Phoenix Contact connector footprint for: GMSTBV_2,5/12-GF-7,62; number of pins: 13; pin pitch: 5.00mm; Angled; threaded flange || order number: 1755600 12A || order number: 1830619 8A 160V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/10-GF-7,62; number of pins: 04; pin pitch: 3.50mm; Vertical || order number: 1766783 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/11-G-3.81; number of pins: 06; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1776906 12A || order number: 1829248 12A 630V Generic Phoenix Contact connector footprint for: MC_1,5/15-GF-3.81; number of pins: 09; pin pitch: 3.50mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1803507 8A 160V Generic Phoenix Contact SPT 2.5/5-H-5.0-EX 1732412 Connector Phoenix Contact, SPT 5/4-H-7.5-ZB 1719215 Connector Phoenix Contact, SPT 5/11-H-7.5-ZB 1719286 Connector Phoenix Contact, SPT 1.5/3-H-3.5 Terminal Block, 1719189 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719189), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022503391_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.65mm; see section.

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