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9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x9.18mm 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 6.73 mm (264 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch.

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