Labels Milestones
BackDH Package; 16-Lead Plastic Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Stretched Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049CH.pdf.
- 25.4x10.6mm^2, drill diamater 1.3mm, pad diameter 2.4mm.
- Sq thermal pad TSSOP HTSSOP 0.65.
- -0.884724 -0.268379 0.381099 facet normal -8.884534e-01.
- XAL8080-XXX, 8.3x8.8x8.0mm, https://www.coilcraft.com/getmedia/345e50d6-a804-4ecb-9a92-5185221faf3e/xal8080.pdf Coilcraft XFL2010, Shielded power.