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[JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Dual Flat No Lead Package (MA) - 2x2x0.9 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40), generated with kicad-footprint-generator JST ZE series connector, B06B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 14, Wuerth electronics 9774040982 (https://katalog.we-online.de/em/datasheet/9774040982.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 6.15 mm (242 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils.

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