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-1.054439e+02 9.665134e+01 1.131388e+01 vertex -1.054990e+02 9.725134e+01 1.135010e+01 facet normal 0.0546401 -0.554737 0.83023 facet normal -0.06948 0.7054 0.705395 facet normal 0.880541 0.472774 0.0336386 facet normal 1.000000e+00 0.000000e+00 facet normal 3.622948e-07 -1.000000e+00 5.810169e-07 facet normal -1.011997e-14 5.429241e-15 -1.000000e+00 d8eca8dc7e Go to file db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill f63cfba954 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and trace routing to de-bodge the pots. From dd8fda85b17279e6d8dbcb525c226736e6399cf9 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Added hard sync to schematic, laid out PCB with exploratory 8hp layout 2x Sockets, all three pins need wires: - glide in (sleeve and normal both GND 6x Sockets, 2pin: - step - reset in - pause in - glide in (sleeve and normal both GND 6x Sockets, 2pin: - all step switches (all go to same bus) - run/stop 2x Pushbutton switches, all 2pin: - step - reset Pots, 3-pin: - Glide attenuator (B10k) (join two left pins from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Clock rate goes down when resistance goes up, opposite to expectation. Schematic fixes: - C1 is too small for a single 1.5 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1.7mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector wire 0.127sqmm strain-relief Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times.

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