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Package 14-lead dip package, row spacing 7.62 mm (300 mils.

• -5.555561e-01 -3.197452e-04 vertex -1.034745e+02 9.507449e+01 3.455000e+01 vertex.
• Pins, http://ww1.microchip.com/downloads/en/DeviceDoc/51751a.pdf module CMS.
• Sharp OPIC, IS485, IS486, see.

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