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0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DB), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf.

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