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But need to call out for) // XKCD (alt tags we don't need a noise and envelope generator synth module. Layout and panel are Kosmo format. * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ``` git clone git@github.com:holmesrichards/precadsr.git git clone git@github.com:holmesrichards/precadsr.git git submodule init git submodule init git submodule update ``` ``` git clone --recurse-submodules git@gitlab.com:rsholmes/precadsr.git ``` ``` git clone git@github.com:holmesrichards/precadsr.git New KiCad version; non Al panel Gerbers ) ) ) Latest commits for file Panels/FireballSpell_Large_bw.xcf Panels/10_step_seq.scad Normal file Unescape 2x Sockets, all three pins need wires: glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below Clock rate (B100k) (not sure yet which 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 6.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 2.0mm 2 pins LED, diameter 8.0mm, 3 pins THT ceramic resonator filter Ceramic Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 4.5x2.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 10.16 mm (400 mils), Socket 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 7.62mm 300mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16.

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