Labels Milestones
BackBGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header THT 2x14 2.54mm double row Through hole angled pin header THT 1x24 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x22 1.27mm double row Through hole angled pin header, 2x05, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x13 1.00mm single row Surface mounted pin header SMD 2x12 2.00mm.
- File attr exclude_from_pos_files exclude_from_bom) Final revision; added.
- 9.290297e+01 2.550000e+00 facet normal -0.0156291 -0.0930619 0.995538 vertex.
- ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10.
- Length 3.04mm diameter 1.6mm Resistor, Axial_DIN0204.