synth_tools

Back

Phoenix MKDS-1,5-13-5.08 pitch 5.08mm size 10.2x10.6mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type094_RT03504HBLU pitch 5mm size 45x7.6mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix PTSM-0,5-8-2.5-V-THR vertical pitch 5mm size 122x15mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MPT-0,5-3-2.54 pitch 2.54mm size 20.78x6.5mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type059_RT06305HBWC, 5 pins, pitch 5mm, size 15x8mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00306 pitch 10mm Varistor, diameter 9mm, width 4.2mm, pitch 7.5mm size 32.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix MKDS-1,5-16 pitch 5mm size 15x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-207, 45Degree (cable under 45degree), 8 pins, pitch 5mm, size 27.3x14mm^2, drill diamater 1.4mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5100, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for a single 1 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Tantalum Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 56 leads (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 1.7mm staggered type-2 TO-220F-5 Vertical RM 2.54mm TO-220-4 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-7, Horizontal, RM 1.7mm, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com.

New Pull Request

Labels Milestones