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BGA (based on standard DIP-4), row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET SQ.

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