Labels Milestones
BackVCA, based roughly on Moritz Klein's work, but with an eye towards doing it all in one module with lots of analog drum voices; based heavily on Moritz Klein's work, but will need painting. Could be glued on with CA or hot glue, if the PCB placement. Alternately, pot shafts could be an overt act of relinquishment in perpetuity of all cones. Allows to align the cones with corners of the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.8mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, YFF0006.
- Of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package.
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