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Pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SN) - Narrow, 3.90 mm Body [TQFP] With Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 56 leads; body width 3 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 1.27mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 2.54mm TO-220F-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM.

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