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3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Surface mounted pin header THT 1x30 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x18 2.00mm single row style2 pin1 right Through hole angled socket strip THT 2x22 1.00mm double row Through hole socket strip SMD 1x25 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x09, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 1x31, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x21 1.27mm single row Through hole angled pin header THT 1x16 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x09 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x06 2.00mm double row Through hole straight socket strip, 1x35, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 2x18 2.54mm double row Through hole pin header SMD 1x38 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x07, 2.54mm pitch, 6mm pin.

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