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2x49 1.27mm double row Through hole straight pin header, 2x11, 1.27mm pitch, double rows Surface mounted pin header SMD 2x29 1.00mm double row surface-mounted straight pin header, 2x01, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x31, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 2x08, 2.54mm pitch, 8.51mm socket length, double rows Through hole socket strip THT 2x23 2.54mm double row Through hole pin header SMD 1x04 1.00mm single row Surface mounted pin header SMD 1x17 2.54mm single row Through hole socket strip SMD 2x21 2.54mm double row Through hole straight socket strip, 2x29, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 2x26, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header 2x07 2.54mm double row Through hole straight pin header, 2x22, 1.27mm pitch, double rows Through hole angled socket strip, 2x40, 2.54mm pitch, single row Surface mounted pin header THT 1x30 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x23 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x40 1.27mm single row style2 pin1 right Through hole pin header SMD 2x29 1.00mm double row surface-mounted straight socket strip, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 1x33 2.54mm single row Through hole IDC header, 2x15, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm.

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