Labels Milestones
BackF672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x13 1.00mm single row Through hole vertical IDC box header, 2x07, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x05 2.54mm double row Through hole IDC header, 2x30, 2.54mm pitch, single row Through hole angled pin header, 2x36, 1.27mm pitch, double rows Through hole angled pin header, 2x25, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x07, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket.
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