Labels Milestones
BackSee http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 1.27mm staggered type-2 TO-220-7, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 2.54mm TO-220-3, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 5.9 mm (232 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf.