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ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf.

6.95595 7.79002 vertex 1 5.39134.
Size 32.5x8.3mm^2 drill 1.3mm.
X 15.9mm Pitch 1.27mm Slug Down (PowerSO-36) [JEDEC.
Normal -2.845744e-001 -4.980052e-001 8.191509e-001.
(https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 32 pins, 18.4x8mm body.

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