3
1
Back

Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Small Outline (SS)-5.30 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, With thermal vias in pads, 5 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip.

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