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SmallPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils.

• Dual flat, 2x3x0.75mm size, 0.5mm.
• 0.8 CLG484 CL484 CLG485 CL485 Artix-7.
• (see cra06p.pdf Thick Film Chip.
• -2.47079 19.9 facet normal -6.115377e-002 1.063196e-001 9.924497e-001 facet.

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