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Spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package.

• Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/70593d.pdf), generated with kicad-footprint-generator.
• 1.105411e-001 vertex 5.043038e+000 1.007356e+000 2.470218e+001 facet.
• -0.0846382 0.279012 0.95655 facet.
• -0.634271 0.0992935 facet normal 0.449667 -0.547914 0.7054 facet.

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