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Diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89016xx, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Slide Switch, right-angle, https://www.ckswitches.com/media/1424/pcm.pdf 0 4 2 Button_Switch_SMD SW_SPST_EVQQ2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE28.pdf Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf 0 2 2 Button_Switch_SMD SW_SPST_EVQP2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89016xx, 16 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xxx-DV-A, 35 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0012, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-16A2, example for new part number: 5273-05A example for new mpn: 39-28-908x, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 502585-0470 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B6P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST PH series connector, 502494-0370 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105310-xx12, 6 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-C (7132-28 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9774130960 (https://katalog.we-online.de/em/datasheet/9774130960.pdf,), generated with kicad-footprint-generator Hirose DF11 vertical Hirose DF13 through hole, DF13-12P-1.25DS, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 900.

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