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BackF.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1.
- Normal 0.360201 -0.282974 0.888921 facet normal 0.772967 -0.634334.
- Thick module pcb_holder(h, l, th, wall_thickness=thickness) { v_wall(h.
- Normal -3.318474e-001 5.689107e-001 7.524745e-001 vertex 2.813232e+000 -3.197688e+000.
- 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70), generated with kicad-footprint-generator.