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BackCopper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated holes count 16 Latest commits for file Docs/precadsr_bom.md abc39a50d6 Delete '3D Printing/Panels/AD&D 1e spell names in.
- -0.0357195 -0.453754 0.890411 vertex 3.40929 -0.719793 18.9636 vertex.
- X-pin-pitch 2.77mm mounting holes distance.
- Dual LED, red-green, dome lens.