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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 2x06, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x26 1.00mm single row Through hole horizontal IDC box header THT 1x08 1.00mm single row style2 pin1 right Through hole IDC header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x17 2.54mm double row surface-mounted straight pin header, 2x37, 2.00mm pitch, single row Surface mounted pin header SMD 1x33 2.54mm single row Through hole.

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