Labels Milestones
BackPad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] with thermal vias; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad LQFP, 32 Pin.
- 205-00083 pitch 10mm Varistor, diameter 7mm, width 5.1mm.
- Http://www.keyelco.com/product-pdf.cfm?p=1386 Fuseholder Clips, 5x20mm Cylinder Fuse.