synth_tools

Back

Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator connector Molex Mega-Fit top entry Molex Sabre Power Connector, 46007-1106, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator Tantalum Capacitor SMD 3640 (9110 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-11A example for new part number: A-41791-0005 example for new part number: AE-6410-07A example for new mpn: 39-30-0240, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0160, 16 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.1 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.7mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_312051_RT045xxUBLC_OFF-022759T.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00307, 11 pins, pitch 5.08mm, size 40.6x8.45mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10690 pitch 3.5mm size 53.2x7mm^2 drill 1.2mm pad 2.4mm Terminal Block WAGO 236-502 45Degree pitch 5mm Varistor, diameter 9mm, width 4.8mm, pitch 5mm size 26.5x15mm^2 drill 1.2mm pad 2.4mm Terminal Block WAGO 236-602, 45Degree (cable under 45degree), 4 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Thick Film Chip Resistor Network, ROHM MNR12 (see mnr_g.pdf Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf Thick Film Chip Resistor Network, ROHM MNR02 (see mnr_g.pdf Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor Network, ROHM MNR12 (see mnr_g.pdf Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf Chip Resistor Network, ROHM MNR12 (see mnr_g.pdf Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf Thick Film Chip Resistor Array, VISHAY (see http://www.vishay.com/docs/28770/acasat.pdf Chip Resistor Network, ROHM MNR18 (see mnr_g.pdf Precision Thin Film Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor.

New Pull Request

Labels Milestones