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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x25, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight pin header, 1x18, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x34 1.27mm single row Surface mounted pin header THT 2x04 1.27mm double row Through hole IDC header, 2x06, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header THT 2x25 2.00mm double row Through hole straight pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x37 1.27mm double row surface-mounted straight pin header, 1x26, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x22, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x39 1.27mm double row surface-mounted straight pin header, 1x38, 2.54mm pitch, single row Through hole straight pin header, 1x17, 2.54mm pitch, single row Through hole straight pin header, 2x05, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Surface.

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