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Back(http://www.ti.com/lit/ds/symlink/tps51363.pdf#page=29), generated with kicad-footprint-generator connector Wago top entry Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, 10 top-side contacts, 0.5mm pitch, 1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 4.4 mm; thermal pad 3x2mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm.
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