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BackRaster, 3.623x3.651mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.65mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.277x3.109mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 2x29 2.54mm double row Through hole straight socket strip, 1x18, 2.00mm pitch, 4.2mm pin length, double rows Through hole pin header SMD 1x33 2.00mm single row Surface mounted socket strip SMD 2x25 2.00mm double row surface-mounted straight pin header, 1x05, 1.27mm pitch, double rows Through hole pin header THT 1x08 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x03 1.27mm single row Through hole angled pin header THT 2x37 1.27mm double row Through hole straight pin header, 1x07, 1.27mm pitch, single row Surface mounted pin header THT 1x20 2.54mm single row Surface mounted pin header SMD 1x14 1.00mm single row style2 pin1 right Through hole socket strip THT 1x16 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x07, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 2x23, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC header triangle being so far out ...Header_2x05_P2.54mm_Vertical_Fixed_Ground_Fill.kicad_mod.
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