Labels Milestones
Back*.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: unplated through holes: ============================================================= f51b7b97734e404127fa5d5d263acbfd66f116e4 Bring in diylc and openscad design f51b7b97734e404127fa5d5d263acbfd66f116e4 Add schematic, start on PCB with on-board components c6741b48f0 More random files main MK_SEQ/Schematics/Unseen Servant/Unseen.
- -9.930239e-001 -4.727985e-003 1.178183e-001 vertex 4.045828e+000 -2.335623e+000.
- MKDS-1,5-12-5.08 pitch 5.08mm length 26mm diameter toroid L_Toroid.
- 8x8 area grid, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf.