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Pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 28 pins TSOP-I, 32.

• 2.611 -1.04 (end 3.211 1.699 (end 3.211.
• -0.995185 -0.0980166 5.85143e-06 facet normal -0.584886 -0.805016 0.0992871.
• 0.630746 0.768414 0.108161 facet normal -0.365098.
• 7 2,5mm vertical SMD spring clamp.
• R3, R21, R27, R28.

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