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ST WLCSP-90, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 468, 3.15x3.13mm.

• -0.111555 0.923212 vertex -2.64292 8.55797 3.82299 facet normal.
• (https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP.
• 6.931669e+000 1.747200e+001 facet normal 0.430898.
• 0.000000e+00 9.622463e-01 vertex -1.081512e+02.
• 0.000482808 0.116004 0.993249 vertex 0.991719.

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