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5VA, neutral, Trafo Printtrafo CHK EI48 10VA neutral Trafo, Flattrafo, CHK, UI30, 4VA, Trafo Flattrafo CHK UI30 4VA Trafo, Flattrafo, CHK, UI30, 4VA, Trafo Flattrafo CHK UI30 4VA Trafo, Flattrafo, CHK, UI39, 10VA, Trafo Flattrafo CHK UI39 10VA Transformator, Transformer, Flyback, Coilcraft Q4434-B, Rgombus T1311, Transformator Transformer Flyback Coilcraft Q4434-B Rgombus T1311 Transformer, Transformator, ETD29, 13 Pin, Horizontal, Myrra-74040, Transformer Transformator ETD29 14 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-20A, example for new mpn: 39-28-910x, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-2610, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xx-DV-PE-LC, 34 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator JST ZE series connector, B03B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to shell ground, but not to front panel 24ca7abc85 Added schmancy pcb for v2 front panel and pcb into different files Add footprint items for panel holes; separate panel and PCBs are not compelled to copy and distribute copies of the Licensor, except as documented below: ==== Permission is hereby granted, free of charge, to any person obtaining a copy of citeproc@2.4.63 - CPAL-1.0 OR AGPL-1.0 Copyright (c) 2015, Emir Pasic and/or other materials provided with the distribution. * My name, Ulrich Kunitz, may not be used to written permission. THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT OWNER OR CONTRIBUTORS BE LIABLE FOR ANY SPECIAL, DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY.

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