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484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink.

• 4.439971e-001 8.576586e-001 facet normal 8.151110e-01 1.320564e-03 5.793033e-01 facet.
• Normal -0.555572 -0.831469 2.57619e-07.

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