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Reduce heat conduction during soldering - ground planes are copper fill applied everywhere.

• 0.000000e+00 9.860631e-01 facet normal -0.884719 -0.268373 0.381114.
• - 90; DivotRadius = KnobMinorRadius*.4; .
• Http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4 TE FPC connector.
• 0.000000e+00 9.994615e-01 vertex -1.063774e+02 9.695134e+01 1.152895e+01 facet.

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