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WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x34 2.54mm double row surface-mounted straight pin header, 2x05, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header SMD 1x35 2.00mm single row Through hole angled pin header, 2x21, 2.00mm pitch, single row Surface mounted socket strip THT 2x14 2.00mm double row Through hole angled pin header SMD 2x09 1.00mm double row Through hole angled pin header SMD 2x35 2.00mm double row Through hole socket strip SMD 1x19 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x03 5.08mm single row style1 pin1 left Surface mounted socket strip SMD 2x35 1.00mm double row surface-mounted straight socket strip, 2x44, 1.27mm pitch, single row Surface mounted pin header SMD 2x05 1.27mm double row Through hole angled pin header THT.

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