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Be adjusted in the same form factor, with maybe a little bit of margin // margins from edges h_margin = thickness*2; v_margin = hole_dist_top*2 + thickness; v_margin = hole_dist_top*2; left_rib_x = thickness * 1; right_rib_x = width_mm - thickness*2.2; left_rib_x = thickness * 1; right_rib_x = width_mm - col_right + tolerance*4; // column from edge plus hole radius // elevated sockets to fit in glide controls 53c46eece113c24bce671b9108c3f713b2229189 Final-ish tweaks More mounting hole 8.4mm m8 Mounting Hole 5.3mm, no annular, M2.5, ISO14580 mounting hole 4.3mm no annular m6 iso14580 Mounting Hole 2.7mm, no annular, M5, DIN965 mounting hole 6.4mm no annular Mounting Hole 2.1mm, no annular m6 Mounting Hole 3.7mm, no annular Mounting Hole 4mm, no annular m2 Mounting Hole 4.3x6.2mm, M4 mounting hole 8.4mm m8 Mounting Hardware, inside blind hole M1.6, height 3.5, Wuerth electronics 9774025951 (https://katalog.we-online.de/em/datasheet/9774025951.pdf), generated with kicad-footprint-generator Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad 3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x22 1.27mm double row surface-mounted straight pin header, 1x04.

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