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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die.

• (left_panel_width) / 2.5; slider_spacing.
• 2.537094e-001 -4.349532e-001 8.639718e-001 facet normal 0.0231039 0.0907043 0.99561.

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