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Description="Low-Power, Dual Operational Amplifiers, DIP-14/SOIC-14 Low-Power, Dual Operational Amplifiers, DIP-8/SOIC-8/TO-99-8"/> Wire Wound Chip Common.

  • B/Panels/futura medium condensed bt.ttf and /dev/null differ.
  • 7.34278 vertex 5.00765 4.19667.
  • For: MSTBVA_2,5/8-G-5,08; number of pins.
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