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DirectFET SB MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MX MOSFET Infineon PLCC, 20 pins, surface mount PLCC, 20 pins, dual row female, vertical entry, strain relief clip Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89007xx, 7 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 48 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0018 example for new part number: A-41791-0006 example for new mpn: 39-28-920x, 10 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wire, reinforced insulation, conductor diameter 0.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Small Outline (ST)-4.4 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [TQFP] With Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 9.53 mm.

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