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II package TSSOP, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=10047&prodName=TLP3123), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-08P-1.25DSA, 8 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.75 mm² wires, reinforced.

-2.769859e-001 9.983999e+000 vertex 3.252574e+000 6.251968e+000 2.496000e+001 vertex.
2.728 0 19.1916 vertex 2.91024 0.759069 19.1916.
Height. [mm] stem_transition_height = 5.
COST OF ALL NECESSARY SERVICING, REPAIR OR CORRECTION.

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