3
1
Back

Like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias 10-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf), generated with kicad-footprint-generator.

New Pull Request