Labels Milestones
BackPlastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted.
- 12.70mm length 33.02mm width 17.78mm.
- -1.089715e+02 9.715134e+01 1.226808e+01 vertex -1.090548e+02 9.695134e+01 1.216890e+01.
- 0.990711 18.9636 vertex 5.99016 0.516674 19.1916.
- (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator Samtec HLE.
- Size 61x10.6mm^2, drill diamater 1.3mm, pad.